TY - M-10456
AU - Narkhede, Kartikeya
TI - Green Bonds: Advancing Eco-Friendly Hot-Melt Pressure-Sensitive Adhesives through Functional Polymer Design
T2 - Scientific Research Journal of Science, Engineering and Technology

PY - 2026
VL - 4
IS - 1
SN - 2584-0584

AB - Hot-melt
pressure-sensitive adhesives (HMPSAs) represent a solvent-free adhesive
technology that integrates the rapid solidification of hot-melt adhesives with
the viscoelastic tack and removability of pressure-sensitive adhesives. While
conventional HMPSAs offer advantages such as high-speed processability and low
volatile organic compound emissions, growing regulatory and environmental
pressures necessitate the development of sustainable and eco-friendly
alternatives. This review critically examines polymer design strategies for
HMPSAs with emphasis on bio-based polymers, renewable tackifiers, viscoelastic
optimization, and recyclability-oriented formulation approaches. Quantitative
structure–property relationships involving glass transition temperature, melt
viscosity, peel and shear strength, and rheological moduli are discussed to
highlight performance–sustainability trade-offs. Advanced characterization
techniques, including probe tack testing, shear adhesion failure temperature
analysis, time–temperature superposition, and atomic force microscopy, are
reviewed to elucidate interfacial and bulk adhesion mechanisms. End-of-life
challenges such as adhesive residue during paper and plastic recycling are
addressed, alongside emerging solutions including clean-removal and
debond-on-demand HMPSAs. The review provides a comprehensive framework for
designing next-generation sustainable HMPSAs that balance performance,
processability, and environmental responsibility.

KW - Hot Melt
KW - Pressure sensitive adhesive
KW - Rheology
KW - Characterisation
DO -