@Article{M-10456,
AUTHOR = {Narkhede, Kartikeya},
TITLE = {Green Bonds: Advancing Eco-Friendly Hot-Melt Pressure-Sensitive Adhesives through Functional Polymer Design},
JOURNAL = {Scientific Research Journal of Science, Engineering and Technology},
VOLUME = {4},
YEAR = {2026},
NUMBER = {1},
ARTICLE-NUMBER = {M-10456},
URL = {https://isrdo.org/journal/SRJSET/currentissue/green-bonds-advancing-eco-friendly-hot-melt-pressure-sensitive-adhesives-through-functional-polymer-design},
ISSN = {2584-0584},
ABSTRACT = {Hot-melt
pressure-sensitive adhesives (HMPSAs) represent a solvent-free adhesive
technology that integrates the rapid solidification of hot-melt adhesives with
the viscoelastic tack and removability of pressure-sensitive adhesives. While
conventional HMPSAs offer advantages such as high-speed processability and low
volatile organic compound emissions, growing regulatory and environmental
pressures necessitate the development of sustainable and eco-friendly
alternatives. This review critically examines polymer design strategies for
HMPSAs with emphasis on bio-based polymers, renewable tackifiers, viscoelastic
optimization, and recyclability-oriented formulation approaches. Quantitative
structure–property relationships involving glass transition temperature, melt
viscosity, peel and shear strength, and rheological moduli are discussed to
highlight performance–sustainability trade-offs. Advanced characterization
techniques, including probe tack testing, shear adhesion failure temperature
analysis, time–temperature superposition, and atomic force microscopy, are
reviewed to elucidate interfacial and bulk adhesion mechanisms. End-of-life
challenges such as adhesive residue during paper and plastic recycling are
addressed, alongside emerging solutions including clean-removal and
debond-on-demand HMPSAs. The review provides a comprehensive framework for
designing next-generation sustainable HMPSAs that balance performance,
processability, and environmental responsibility.},
DOI = {}
}